Monday, June 22, 2026

Samsung to Ship First HBM4 in Feb. 2026: 11.7 Gbps Speeds and 3 TB/s Bandwidth for AI Chips

Samsung Electronics announces it will ship the sixth-generation HBM4, enhancing AI capabilities and reclaiming semiconductor leadership.

AI Breakthrough Enables Robots to Understand Complex Human Instructions in 3D Spaces

GIST researchers led by Professor Kim Eui-hwan developed Context-Nav, an AI technology enabling robots to navigate using human language.

Seoul Asan Team Performs Asia-Pacific’s First Robotic Supermicrosurgery Connecting Submillimeter Vessels

South Korean researchers successfully connected ultrafine blood vessels using a supermicrosurgery robot, enhancing reconstructive surgery techniques.

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