Tuesday, March 17, 2026

HLB BioStep Signs Strategic MOU with CLIPS BnC… Toward Integrated Preclinical and Clinical Development

HLB BioStep and CLIPS BnC sign MOU to enhance collaboration between preclinical and clinical stages of drug development.

H&M’s Collaboration with Korean Designer Brand Rokh Sells Out in Hours

H&M's collaboration with Korean designer brand Rokh...

U.S. and South Korean Air Forces Conduct High-Stakes Live-Fire Exercises

The U.S. and South Korean Air Forces are conducting live-fire exercises from today until the 28th, using over 60 aircraft.

Tag: HBM4

North KoreaKoreaKimMilitarySouth KoreaAIrelationsmarketInternational

Samsung to Ship First HBM4 in Feb. 2026: 11.7 Gbps Speeds and 3 TB/s Bandwidth for AI Chips

Samsung Electronics announces it will ship the sixth-generation HBM4, enhancing AI capabilities and reclaiming semiconductor leadership.

Hanmi Semiconductor Secures SK Hynix Order for HBM TC Bonders

Hanmi Semiconductor secures a 9.7 billion KRW contract with SK Hynix for TC bonder equipment for HBM production by April 1.

SK Hynix to Debut Sixth-Gen HBM4 – Mass Production Coming Soon

SK Hynix reveals its HBM4 memory model at GTC 2025, aiming for mass production to enhance AI capabilities in various sectors.

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