Monday, June 15, 2026

Samsung to Ship First HBM4 in Feb. 2026: 11.7 Gbps Speeds and 3 TB/s Bandwidth for AI Chips

Samsung Electronics announces it will ship the sixth-generation HBM4, enhancing AI capabilities and reclaiming semiconductor leadership.

LIG Defense Expands into the U.S. Market with its First Local Subsidiary

LIG Defense & Aerospace launches LIG Defense U.S. Inc. to enhance its presence in the U.S. defense market, led by retired Vice Admiral Rich Brown.

“Iron, Blood, and Broken Souls”: The Grim Reality Behind North Korea’s Newest “Paradise”

North Korea's Prime Minister inspects key construction projects while a new ambassador to Belarus presents credentials amid national celebrations.

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