AMD Chief Executive Officer (CEO) Lisa Su has strengthened a comprehensive artificial intelligence (AI) partnership with Samsung Electronics through consecutive meetings with the company’s executives over two days. Following the formalization of next-generation memory collaboration with the semiconductor (DS) division on Wednesday, Su expanded the scope of cooperation to include the device experience (DX) division, covering mobile and PC sectors on Thursday.
Lisa Su meets with President Roh Tae-moon for an Hour at Seocho Headquarters
On Thursday morning, CEO Su visited Samsung Electronics’ Seocho headquarters in Seoul, meeting with Samsung’s DX division head, President Roh Tae-moon, for about an hour to discuss collaboration strategies.
Arriving at the office around 8:50 a.m., Su briefly shared her expectations with reporters, stating that she’s looking forward to many productive discussions today. When asked about potential talks on enhancing the competitiveness of AI personal computers (PCs) and premium mobile products, she cryptically replied that it’ll see, hinting at in-depth strategic discussions between the two tech giants.
During this meeting, both sides reportedly focused on optimizing AMD’s next-generation processors with Samsung’s Galaxy mobile and laptop lineup, as well as collaborating on on-device AI technology. This move is seen as a strategic step to connect the semiconductor supply chain partnership established the previous day with Samsung Electronics Chairman Lee Jae Yong and the DS division’s management to bolster the competitiveness of finished products.
Samsung-AMD alliance solidified at Seungjiwon… HBM4 and Foundry Partnership Confirmed
The previous afternoon, CEO Su met with Samsung Electronics Chairman Lee for a 137-minute dinner meeting at Seungjiwon in Hannam-dong, Yongsan-gu, Seoul. This venue, known for hosting global dignitaries, served as a symbolic location for both leaders to forge a blood alliance aimed at securing leadership in the next-generation AI semiconductor market.
The memorandum of understanding (MOU) signed earlier at Samsung’s Pyeongtaek campus lays the practical foundation for this partnership. Under the agreement, AMD has selected Samsung as the preferred supplier for the sixth generation of high-bandwidth memory (HBM4) and plans to incorporate it into its latest AI accelerator, the Instinct MI455X graphic processing unit (GPU). Samsung aims to maximize the learning and inference performance of AMD’s AI systems using the HBM4, which is based on the 1c DRAM and 4-nanometer base die technology that began mass production in February.
The collaboration extends beyond HBM, reaching into server central processing units (CPUs) and foundry services. Samsung will supply next-generation DDR5 solutions for AMD’s sixth-generation EPYC CPUs and the data center platform Helios. Kyung Kye-hyun, CEO of Samsung’s DS Division, expressed strong confidence, stating that Samsung possesses unique turnkey capabilities that support AMD’s roadmap from HBM4 to foundry and packaging.
The industry is particularly focused on the foundry collaboration. Samsung’s one-stop solution that connects memory, foundry, and packaging aligns with AMD’s supply chain diversification strategy, significantly increasing the potential for future next-generation products to be produced under contract.
A Samsung representative emphasized that this MOU signifies the expansion of the 20-year partnership into the entire AI ecosystem, adding that it will continue to enhance the collaboration with global tech leaders to provide optimal AI infrastructure.