LG Electronics is ramping up its expansion in the Heating, Ventilation, and Air Conditioning (HVAC) sector through a comprehensive HVAC solution tailored for Artificial Intelligence (AI) data centers. This innovative approach offers end-to-end services, spanning from thermal management to energy optimization.
LG Electronics announced on Tuesday that it will showcase an array of HVAC solutions for AI data centers at Data Center World (DCW) 2026, a three-day event kicking off on Monday in Washington D.C. The company aims to leverage this platform to explore new business opportunities and broaden its market presence.
DCW is a premier industry event that attracts major tech and semiconductor firms. It features a diverse program of seminars and business meetings covering topics such as AI technology trends, infrastructure development, and energy efficiency strategies.
LG Electronics is set to unveil cutting-edge liquid cooling and immersion cooling solutions specifically engineered for AI data centers.
The company has made significant strides in its liquid cooling technology, which efficiently manages heat generated by high-performance chips using advanced liquid-based systems.
At the heart of the liquid cooling solution is the Coolant Distribution Unit (CDU). This key component employs Direct-to-Chip Cooling (DTC) technology, circulating cold coolant through a metal plate (Cold Plate) positioned directly above the chips to manage heat in AI data centers. This innovative approach is gaining traction as a next-generation solution due to its space efficiency and high energy performance.
LG Electronics’ CDU features a specially designed metal plate structure that optimizes coolant flow, effectively dissipating heat from high-performance chips. The system incorporates virtual sensor technology, ensuring reliable operation even if some physical sensors fail. This is achieved by using data from pumps and other sensors to correct faulty sensor readings. Notably, the cooling capacity has been more than doubled, jumping from 650 kW to an impressive 1.4 MW.
In a collaborative effort with U.S.-based immersion cooling specialist Green Revolution Cooling (GRC) and SK Enmove, LG Electronics will debut its immersion cooling solution. This groundbreaking technology submerges heat-generating electronic devices, such as data center servers, directly in a specialized non-conductive cooling liquid.
Starting this year, LG Electronics plans to strengthen its portfolio of data center cooling solutions. The company will continue to develop and refine its liquid cooling solutions, including the market-ready CDU, while advancing its immersion cooling technologies.
Strong Capabilities in Air Cooling… Improved Energy Efficiency and Precise Internal Temperature Control
The company has established a strong reputation in air cooling systems, offering precise management of temperature and humidity within AI data center server rooms. Drawing on over a decade of experience in supplying cooling solutions to domestic and international data centers, LG Electronics has expanded its product range from water-cooled chillers to advanced air-cooled Free Cooling chillers.
LG Electronics’ air-cooled Free Cooling chiller is designed to optimize energy consumption and operation based on internal temperature fluctuations, making it an ideal choice for energy-intensive data centers. The system incorporates a high-performance inverter compressor to efficiently manage energy loads.
Additionally, LG Electronics offers a Data Center Cooling Management (DCCM) system. This sophisticated integrated management software remotely monitors complex equipment, including CDUs, Computer Room Air Handlers (CRAHs), and chillers. It performs data analysis and implements optimal control measures. The system proactively detects changes in component lifespans and identifies early warning signs of potential issues, enabling preemptive responses to prevent server shutdowns.
The company is enhancing its software and power infrastructure solutions to optimize energy usage in AI data centers. By boosting energy efficiency, these solutions allow AI data centers to reduce power consumption while simultaneously increasing data processing capabilities.
At the exhibition, LG Electronics will showcase an innovative energy operating platform developed in partnership with PADO, a clean tech startup spun off from LG North American Innovation Center (LG NOVA). This advanced platform monitors data center cooling and power systems in real-time, identifying energy waste and redistributing resources to areas of greatest need.
LG Electronics will also introduce a DC Grid Solution for data center operations, co-developed with LG Energy Solution, LS ELECTRIC, and LS Cable & System. This solution minimizes power conversion steps typically found in conventional AC systems, significantly reducing energy losses. While traditional systems may lose up to 25% of energy, the DC Grid Solution can potentially lower initial power losses to approximately 15%.
Lee Jae-sung, President of LG Electronics’ Eco Solution (ES) Business Division, stated that they’re committed to expanding the footprint in the AI data center HVAC market by leveraging our comprehensive solution capabilities and differentiated technologies, from thermal management to energy efficiency optimization.