Friday, May 1, 2026

North Korea’s ‘Trash Balloon’ Lands, Causes Fire in South Korea—Get the Details

A balloon launched by North Korea fell onto the rooftop of a multi-family house in the Deogyang District of Goyang City, causing a fire.

North Korea Tests Hypersonic Missile with New Stealth Tactics to Evade Detection

North Korea's hypersonic missile test from a new site shows efforts to enhance surprise attack capabilities against adversaries.

High on Gummies: The New Disturbing Marijuana Trend

The police arrested several people after ingesting...

Tag: HBM4

How AMD’s New Alliance with Samsung is Set to Transform the AI Semiconductor Landscape in 2026

AMD and Samsung strengthen AI partnership, focusing on next-gen processors and memory for mobile and PC sectors.

Samsung to Ship First HBM4 in Feb. 2026: 11.7 Gbps Speeds and 3 TB/s Bandwidth for AI Chips

Samsung Electronics announces it will ship the sixth-generation HBM4, enhancing AI capabilities and reclaiming semiconductor leadership.

Hanmi Semiconductor Secures SK Hynix Order for HBM TC Bonders

Hanmi Semiconductor secures a 9.7 billion KRW contract with SK Hynix for TC bonder equipment for HBM production by April 1.

SK Hynix to Debut Sixth-Gen HBM4 – Mass Production Coming Soon

SK Hynix reveals its HBM4 memory model at GTC 2025, aiming for mass production to enhance AI capabilities in various sectors.

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