Friday, July 31, 2026

Apple’s First Foldable iPhone: How It Compares to Samsung Galaxy Z Fold 7 in Size and Battery

Apple's foldable iPhone, set for fall release, features a compact design, innovative button layout, and a powerful 5,500mAh battery.

MINI Expands the Lineup: New 5-Door Cooper Balances Speed and Space

MINI Korea launches the New MINI Cooper C 5-Door with a spacious interior, advanced tech, and sporty trims for enhanced driving experience.

South Korea Unveils New Blood Management Plan to Stabilize Supply Amid Demographic Shift

The Korean government is enhancing blood donation efforts, targeting younger donors and revising eligibility criteria to ensure stable supply.

Tag: HBM4

Samsung’s 4nm Ultra-Low Power Process: Revolutionizing HBM4 Technology

Samsung Electronics developed a groundbreaking 4-nm ultra-low-power process for HBM4, enhancing performance while reducing power consumption.

Samsung’s HBM4 Sales Surpass 1 Billion USD: What This Means for the Future of AI Memory

Samsung Electronics' HBM4 sales exceed $1 billion, driven by AI demand, with projections for significant growth in the coming years.

How AMD’s New Alliance with Samsung is Set to Transform the AI Semiconductor Landscape in 2026

AMD and Samsung strengthen AI partnership, focusing on next-gen processors and memory for mobile and PC sectors.

Samsung to Ship First HBM4 in Feb. 2026: 11.7 Gbps Speeds and 3 TB/s Bandwidth for AI Chips

Samsung Electronics announces it will ship the sixth-generation HBM4, enhancing AI capabilities and reclaiming semiconductor leadership.

Hanmi Semiconductor Secures SK Hynix Order for HBM TC Bonders

Hanmi Semiconductor secures a 9.7 billion KRW contract with SK Hynix for TC bonder equipment for HBM production by April 1.

SK Hynix to Debut Sixth-Gen HBM4 – Mass Production Coming Soon

SK Hynix reveals its HBM4 memory model at GTC 2025, aiming for mass production to enhance AI capabilities in various sectors.

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