Hanmi Semiconductor announced on Wednesday that it has secured a 9.7 billion KRW (approximately 6.6 million USD) contract with SK Hynix to supply thermal compression (TC) bonder equipment for high-bandwidth memory (HBM) production.
The contract, valued at 9.65 billion KRW (about 6.53 million USD), stipulates that the equipment delivery will be completed by April 1.
The TC bonder is capable of manufacturing both the current industry-standard HBM3E (5th generation) and the upcoming HBM4 (6th generation), which is slated for commercial rollout by year-end.
