LG Chem is set to participate in SEMICON Taiwan 2026, Asia’s largest semiconductor exhibition, aiming to secure new semiconductor customers and expand business partnerships.
From September 2 to 4, LG Chem will showcase advanced packaging solutions for artificial intelligence (AI) semiconductors, including high-bandwidth memory (HBM), as well as power semiconductor materials at the Taipei Nangang Exhibition Center, the company announced on the 26th.
SEMICON Taiwan is a premier event showcasing cutting-edge semiconductor technology trends, including advanced packaging and AI semiconductors. It’s widely regarded as a key industry gathering where major players from semiconductor manufacturers, outsourced semiconductor assembly and test (OSAT) companies, and substrate and packaging firms converge for extensive technology exchange and business collaboration.
LG Chem will unveil a range of semiconductor material solutions targeting the growing AI semiconductor and high-performance computing (HPC) markets at its booth on the fourth floor of Hall 2 (TaiNEX 2) in the Nangang Exhibition Center.
The company will present an array of materials used in advanced packaging processes, including copper clad laminate (CCL), glass core solutions, build-up film, dry film solder resist (DFSR), photo imageable dielectric (PID), die attach film (DAF), bonding/debonding solutions, and strippers for fine processes.
Moreover, LG Chem plans to exhibit key materials that enhance semiconductor performance through improved efficiency and thermal management of power semiconductors for AI data centers. These include conductive sintering paste (Ag/Cu), thermal interface materials (TIM), and thermal management device solutions based on copper metal foam.
Through this exhibition, LG Chem aims to expand collaborations with leading semiconductor manufacturers, OSAT companies, and substrate and packaging firms. The company’s strategy is to broaden its customer base in the AI semiconductor and advanced packaging markets by promoting technology exchanges and identifying new projects, thereby accelerating the growth of its semiconductor materials business.
LG Chem’s Chief Executive Officer (CEO), Kim Dong-choon, stated that as the AI semiconductor and advanced packaging markets expand, it’s seeing increased demand for high-performance materials. LG Chem is committed to leveraging the diverse material portfolio to strengthen partnerships with semiconductor customers and actively pursue growth opportunities in the future semiconductor market.
LG Chem currently plans to double its electronic materials business, valued at approximately 1 trillion KRW (about 722 million USD), by 2030. To achieve this goal, the company has identified semiconductor, automotive, and next-generation display materials as core business areas. It has also integrated and established related advanced research and development organizations under its Advanced Materials Research Institute. Furthermore, LG Chem is accelerating the development of high-value-added electronic materials by bolstering its semiconductor packaging material portfolio.