Samsung Electronics and Broadcom are set to embark on a strategic partnership worth over 200 billion USD in the memory and foundry sectors over the next five years, through 2030. This collaboration aims to significantly expand their technological cooperation in the artificial intelligence (AI) semiconductor field.
On July 24, Samsung Electronics announced the signing of a strategic memorandum of understanding (MOU) with global AI semiconductor giant Broadcom. The agreement, focused on building next-generation AI core infrastructure, was inked at the AI Summit held at The Midway in San Francisco.
The AI Summit was attended by key executives from both companies, including Han Jin-man, President of Samsung Electronics’ Foundry Division, and Hock Tan, Chief Executive Officer (CEO) of Broadcom, along with government officials.
Samsung Electronics plans to leverage its unique One-Stop Turnkey Solution – encompassing memory, foundry, and advanced packaging – to enhance its partnership with Broadcom and deliver unparalleled value to customers in the burgeoning AI semiconductor market.
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This collaboration has captured industry attention, uniting Broadcom’s leadership in custom semiconductor design with Samsung Electronics’ comprehensive expertise in memory, manufacturing, and packaging technologies.
Samsung Electronics will harness its world-class memory technology and competitive edge to provide advanced memory solutions, including high band-width memory (HBM), significantly enhancing the performance and competitiveness of Broadcom’s AI accelerators.
In February, Samsung Electronics made history by becoming the first to mass-produce HBM4, incorporating 1c dynamic random access memory (DRAM) and 4nm base die technology. The company further cemented its leadership in next-generation HBM technology by supplying HBM4E samples to customers in May.
Samsung’s HBM is set to become a cornerstone memory solution, maximizing the performance of Broadcom’s AI accelerators. Its industry-leading performance, reliability, and power efficiency will be crucial in supporting next-generation AI infrastructure competitiveness.
Strengthening Broadcom’s AI Chip Competitiveness with 2nm Foundry and Advanced Packaging
In the foundry sector, Samsung will apply its advanced sub-2nm processes to Broadcom’s key product lineup, including communication semiconductor solutions for next-generation high-speed data transmission, thereby enhancing overall product competitiveness.
Samsung Electronics will support the development of high-performance, energy-efficient AI semiconductors through its advanced packaging technology based on 2nm processes, offering Broadcom differentiated AI semiconductor solutions.
Furthermore, Samsung will streamline the entire process from chip design to mass production, optimizing semiconductor design and manufacturing to reduce product development timelines while maximizing performance and power efficiency.
Leveraging its technological prowess, Samsung Electronics plans to continually expand its collaboration with Broadcom in next-generation AI semiconductors and actively pursue new opportunities in the rapidly growing AI and high-performance computing markets.
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This agreement is viewed as a strategic alliance aimed at strengthening cooperation between the two tech giants across memory, foundry, and advanced packaging – core semiconductor technologies for the AI era – and enhancing the competitiveness of the next-generation AI semiconductor ecosystem.
Jun Young-hyun, head of Samsung Electronics’ DS division, stated that in the AI era, semiconductor solutions that seamlessly integrate memory, logic, and advanced packaging are crucial. By deepening our collaboration with Broadcom, it aims to accelerate the development of future AI infrastructure and deliver unprecedented value to the customers.
Charlie Kawas, President of Broadcom’s Semiconductor Solutions Group, commented that as AI infrastructure rapidly expands, close collaboration across the semiconductor ecosystem becomes increasingly vital. Through the partnership with Samsung Electronics, it’s committed to creating next-generation solutions tailored to the diverse and evolving demands of the market.
Through this agreement, Samsung Electronics aims to enhance its leadership in next-generation semiconductor technology and manufacturing capabilities, spearheading innovation in the global AI semiconductor ecosystem.
Earlier at the AI Summit, Samsung Electronics Chairman Lee Jae-yong underscored the importance of global cooperation in the AI era. He stated that building a comprehensive ecosystem – from innovative AI models and cutting-edge semiconductors to data centers for reliable services and abundant power – necessitates global collaboration that transcends borders.